| Publisher | University of Engineering and Technology, Taxila | ||
|---|---|---|---|
| Format | 348.5KB PDF | Date added | 14 Dec 2004 |
| Topics | Local Area Networks (LAN), Wireless LAN | ||
| Downloads | 29 | ||
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A System-on-a-Package (SoP) approach can solve these problems. High quality components can be integrated in the package. This paper reports a fully integrated single-package RF prototype module for a 5 GHz WLAN receiver front-end, which is intended to demonstrate the concept of SoP integration. The approach that is illustrated here is implemented with a thin film Multichip Module (MCM-D) interconnect technology. This technology also allows the integration of high quality passive components. With these passives, low-loss filters can be implemented.
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