This paper outlines a new co-design methodology that enables design and analysis of the electronic system interconnect from IC to IC, across packages, connectors, backplanes, and PCBs. Supported by a unique technology platform, the new methodology enables engineers to co-design an IC, its package, and its PCB, optimizing the system interconnect. Many companies will be able to remove weeks or months from the design process with the combination of best practices and deployment of the proposed co-design methodology and associated technology platform.
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