| Publisher | Silicon Laboratories | ||
|---|---|---|---|
| Format | 43.3KB PDF | Date added | 05 Oct 2004 |
| Topics | Mobile - Wireless Communications, GSM, GPS - GIS | ||
| Downloads | 30 | ||
As little as three years ago, GSM power amplifier (PA) solutions were poorly integrated. The transmit system solution required individual ICs for low band, high band and power control and many discrete components for input and output matching networks, harmonic filtering, decoupling capacitors and all the support components for the power control function. This lack of integration was due to process technology, simulation tools, requirement for high-Q (low-loss) passives, and stringent requirements of the 3GPP (GSM) specification. However, in the last two years PA solutions have integrated external functions and components into a multi-chip module, thereby decreasing the footprint and the complexity of the solution.
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