Next-generation semiconductor factories need to support miniaturization below 100 nm and have higher production efficiency, mainly of 300-mm-diameter wafers. Particularly to reduce the price of semiconductor devices, shorten development time [thereby reducing the TAT (turn-around time)], and support frequent product changeovers, semiconductor manufacturers must enhance the productivity of their systems. To meet these requirements, Hitachi proposes solutions that will support e-manufacturing on the next-generation semiconductor production line. This paper describes the optimum process control technology and e-diagnostics developed by Hitachi as core technologies supporting e-manufacturing and their expanded use in the future.
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