This white paper describes the features of the VIA ProSavageDDR KM266 chipset as well as the combination of performance and cost efficiency that enables next generation computing for mainstream and value desktops, workstations, and servers based on the AMD Athlon XP processor. The launch of the VIA ProSavageDDR KM266 further extends the leadership role that VIA has played in enabling rapid industry wide transitions to higher bandwidth memory technologies and integrated graphics solutions that enable OEMs and SIs to address a fuller spectrum of PC price points.
Did you find this white paper useful?
31 out of 50 users found this white paper useful
Related white papers
Cisco Catalyst 4500 Series Supervisor Engine 6-E CenterFlex Technology
Cisco CenterFlex technology, innovations enabled by the centralized Application-Specific Integrated Circuit (ASIC) complex at the heart of the Cisco Catalyst 4500 Series Supervisor Engine 6-E, addresses the need for improved...
ACT: A Cluster Co-Processor for 3G Baseband Wireless
Architectures for wireless systems have traditionally been designed to meet real-time requirements, t on a limited die area, and operate within a low power budget. These conditions are usually met...
Utilizing Intel Virtualization Technology on an Intel 5000 Chipset Series-Based Platform
System architects in the Server and Workstation Multiprocessing environments have been actively using Virtualization Technology to realize cost savings through hardware consolidation, fast fail-over mechanisms (without extra hardware), and other...
Satisfying the Demand for Rapid Feature Enhancement in Consumer Display Products
Developers of consumer display products (i.e., High-Definition TeleVisions (HDTVs), monitors, and projectors) face a daunting design challenge. The Application-Specific Standard Products (ASSPs) that have been used in these products historically...
Video and Image Processing Design Using FPGAs
In this paper, the authors will look at the trends in video and image processing that are forcing developers to re-examine the architectures they have used in the past. This...
Optimization of Silicon Technology for the IBM System z9
IBM 90-nm Silicon-On-Insulator (SOI) technology was used for the key chips in the System z9 processor chipset. Along with system design, optimization of some critical features of this technology enabled...
High-Speed Interconnect and Packaging Design of the IBM System z9 Processor Cage
This paper describes the system packaging and technologies of the IBM System z9 enterprise-class server. The central electronic complex of the system consists of four nodes, each housing a MultiChip...
