This paper outlines the technical challenges of implementing single-chip RF solutions for TDMA/AMPS handsets, and shows how designers at Zarlink Semiconductor are meeting these challenges. The TDMA/AMPS handset chip described in the paper is a highly integrated RF subsystem that minimizes external components and optimises the baseband-to-RF interface. Such a chip provides a cost-effective solution for producing attractively priced handsets for North American, Central American, and South American markets.
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