| Publisher | Ultratech Stepper | ||
|---|---|---|---|
| Format | 527.9KB PDF, requires Acrobat Rdr 5 | Date added | 06 Jun 1998 |
| Topics | Semiconductor Tech. - Manufacturing | ||
| Downloads | 60 | ||
The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. In addition, the specific photoresist optical properties and develop characteristics degrade the critical dimension (CD) control for these ultra-thick films. The bulk absorption effect of the photoresist reduces the effective dose at the bottom of the film. This effect is exacerbated by the isotropic wet development process which produces sloped profiles. Unlike thin photoresist for IC manufacturing, lithography modeling and characterization are not readily available for ultra-thick photoresist films.
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