| Publisher | Ultratech Stepper | ||
|---|---|---|---|
| Format | 568.0KB PDF, requires Acrobat Rdr 5 | Date added | 17 Mar 1999 |
| Topics | Semiconductor Tech. - Manufacturing | ||
| Downloads | 30 | ||
The process optimization required to obtain high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios far exceed those encountered in advanced submicron lithography for integrated circuit (IC) manufacturing. Physical properties such as adhesion and structural rigidity play a critical role in obtaining high aspect ratios in dense line and space patterns. The photoresist optical properties and developer characteristics are more significant for patterning isolated structures. Unlike typical photoresists for IC manufacturing, lithography modeling and characterization tools are not available for photoresist films in this thickness range.
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