| Publisher | Ultratech Stepper | ||
|---|---|---|---|
| Format | 179.1KB PDF, requires Acrobat Rdr 5 | Date added | 30 Apr 2004 |
| Topics | Semiconductor Tech. - Manufacturing | ||
| Downloads | 34 | ||
The stress buffer application has been accepted by the industry for many years and has achieved a very good reliability history since its introduction for plastic packages. This application uses a thick film of polyimide as a buffer layer between the passivation layer of the device and the molding material of the plastic package. The thick film of polyimide absorbs the stress imposed by the molding resin for which thermal coefficients are larger than that of the silicon chips and lead-frames. Traditionally, the polyimide lithographic process involves a trilayer film consisting of an adhesion layer, a polyimide film, and photoresist. The advanced development of photosensitive polyimide has opened a new door for semiconductor manufacturers to realize significant cost savings. Using photosensitive polyimide can substantially reduce the total number of process steps used in the traditional polyimide process.
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