| Publisher | Ultratech Stepper | ||
|---|---|---|---|
| Format | 626.8KB PDF, requires Acrobat Rdr 5 | Date added | 01 Mar 2000 |
| Topics | Semiconductor Tech. - Manufacturing | ||
| Downloads | 13 | ||
Polyimides have become the standard material used in a variety of semiconductor manufacturing processes. They are commonly used as a passivation stress-buffer process (PSB) for devices in thin and ultra-thin packages. Particular devices of concern include large-die devices packaged in plastic molding compounds, exemplified by dynamic random access memory (DRAM) components. These die are subject to significant amounts of stress, primarily resulting from differing coefficients of thermal expansion of the die and packaging compounds. These stresses may lead to cracking of the package or the protective passivation layer, allowing the introduction of contaminants such as moisture and ionic particles. Imparted stress may also lead to metal or wire-bond deformation, possibly altering device parameters. In both cases device reliability and yield may be severely degraded. To reduce stress imparted to the die, a relatively thick layer of polyimide is applied over passivation.
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