| Publisher | Ultratech Stepper | ||
|---|---|---|---|
| Format | 138.3KB PDF, requires Acrobat Rdr 5 | Date added | 30 Apr 2004 |
| Topics | Semiconductor Tech. - Manufacturing | ||
| Downloads | 52 | ||
A crucial aspect of alignment system performance in integrated circuit manufacturing is the impact of photoresist thin film effects over alignment targets. Differences in photoresist coating such as conformal versus planarizing step coverage and symmetric versus asymmetric step coverage can potentially impact the resulting alignment capability and obtainable process window. These differences in coating properties are closely coupled to photoresist material properties including solvent type(s), polymer molecular weights, sensitizer level, dye level and viscosity. Photoresist application has also been noted to have significant impact on step coverage, and includes such factors as dispense technique, spin speed, acceleration, spin time, softbake temperature and softbake time.
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