| Publisher | MOREnet (Missouri Research and Education Network) | ||
|---|---|---|---|
| Format | HTML & PDF | Date added | 12 Jul 2001 |
| Topics | DWDM, Frame Relay, T1, T2, T3, TCP - IP | ||
| Downloads | 18 | ||
Several forms of bonding or 'gluing' physical circuits together to increase bandwidth exist. Currently, MOREnet bonds 2 or more T-1s by using the multiple link feature in the router, which utilized the CPU to sort out the TCP/IP packets as they arrive as well as to send them out over the multiple links. This is not an effective solution, as the process takes up extensive CPU time on both the edge router and the core router. The demand is linear, so there is no efficiency as the number of links increases.
The Frame Relay Forum has two standards for bonding Frame Relay circuits together, FRF.15 and FRF.16. However, these standards have seen little implementation by hardware vendors, and no service offerings are available using this technique.
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