There are two common designs for forced convection cooling of electronic products. In first approach, Push System the enclosure is pressurized using fans at the inlet. The flow path is designed to cool the circuit. The Pull System has the fans at the exit. The low pressure caused at the exit area of the enclosure pulls air through the desired flow path. We will discuss the features, pros and cons of these two approaches.
As shown in this white paper the air mover is placed at the air inlet of the enclosure, usually at the bottom to take advantage of natural convection. The air filter is also placed at the inlet before or after the fans. The discharge zone of the fans is provided with a mixing
space for uniform flow.
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