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A New IEEE 1149.1 Boundary Scan Design for the Detection of Delay Defects

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Publisher Special Interest Group on Design Automation (SIGDA)
Publisher Registration Direct Access
Topics Interfaces / Buses / I/Os Date added 31 Oct 2003
Downloads 28 Format 68.3KB PDF, requires Acrobat Rdr 5

Boundary scan design is a design for testability technique to simplify the application of test patterns for the detection and diagnosis of different faults at levels of packages (e.g. chips, modules, boards, backplanes). In-circuit test based on the bed-of-nails probing technique makes it possible to test each chip and the interconnections among chips. However it requires the automatic test equipment to probe each chip pin and the increasing use of surface mounting techniques make it difficult to perform in-circuit test. Delay defects on I/O pads, interconnections of a board, or interconnections among embedded cores can not be tested with the current IEEE 1149.1 boundary scan design. This paper introduces a simple design technique which slightly modifies the TAP controller to test delay defects by postponing the UpdateDR with EXTEST instruction. Furthermore 2log(N+2) interconnect test patterns are proposed for both static and delay testing.

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